3D pico-second laser micro processing system consists of a pico-second laser, dynamic focusing system, 2D scanning system, external vacuum system and precision control. The system has the features on high peak power and high speed scanning, which result in high speed dynamic-focusing marking, engraving and micro cutting. The vacuum system makes the processing cleaner. The system is suitable for clean and precision marking and cutting.
|Pulse repetition rate||100kHz-1000kHz|
|Laser beam pointing||<50μrad|
|Beam divergence angle||≤3mrad|
|Long-time operation stability||≤3%|
|Dynamic Focusing System|
|Allowed max. laser power||150W @1064nm|
|Typical scanning field||110x110mm|
|Typical focused beam diameter||32μm|
|Power supply||±15V DC, max 2A|
Upon request, we can use different lasers with different laser wavelength such as 532/355nm, different pulse width from ns to fs, different laser power from 4W to 100W.